Molex's Micro-Fit 3.0 Connector Systems, available in multiple circuit sizes and cable lengths for power applications
Online PR News – 07-November-2017 – Hong Kong, Asia – Molex's Micro-Fit 3.0 Connector Systems, available in multiple circuit sizes and cable lengths for power applications, offer a 3.00mm pitch, a 10.0A maximum current rating and many design options such as a terminal position assurance, blind-mating and compliant pin features.
The Molex's Micro-Fit Connector Family offers 10.0A with a 3.00mm pitch, delivering power in a compact package in wire-to-wire and wire-to-board configurations. OEMs often need power connectors in space-constrained applications.
Micro-Fit 3.0 BMI Connectors are designed for blind-mating applications. They allow mating misalignment (per product drawing). In hard-to-reach applications, such as drawers or fan assembly trays, connectors need to be mated and unmated without being seen. Doing so can cause damage to the connector and/or terminal and consume valuable labor time.
The Micro-Fit TPA Connector Family helps prevent failure in end products by offering terminal position assurance (TPA). The TPA reduces terminal back-out by providing locking redundancy; assemblers cannot insert the TPA unless terminal is properly inserted.
Micro-Fit 3.0 CPI (Compliant Pin) Connectors provide a compliant pin interface while maintaining all the features of the standard Micro-Fit 3.0 Connector. The robust eye-of-the-needle design provides a reliable interface when recommended board layouts are followed. The Micro-Fit 3.0 CPI Header mates with Micro-Fit 3.0 Receptacle, allowing running changes as boards' transition from solder to press-fit applications. For lower applied costs, OEMs often prefer a compliant pin connector over one that requires soldering.
Micro-Fit 3.0 RMF (Reduced Mating Force) Terminals are designed for applications needing lower engagement and disengagement forces or when the units are cycled frequently. The pre-lubricated version can be mated up to 250 times and fit into standard Micro-Fit 3.0 Housings. Applications often require rugged terminals and lower mating force to reduce operator fatigue during assembly and/or to withstand high-mating cycles.
As authorized distributor for Molex, Heilind Asia provides Molex products and also value added services. Heilind Asia supports both original equipment and contract manufacturers in all market segments of the electronics industry, stocking products from the industry's leading manufacturers in 25 component categories, with a particular focus on interconnect and electromechanical products.
About Heilind Electronics:
Founded in 1974, Heilind Electronics, Inc. (www.heilind.com) is one of the world's leading distributors of connectors, relays, switches, thermal management & circuit protection products, terminal blocks, wire & cable, wiring accessories and insulation & identification products. Heilind has over 40 facilities in the United States, Canada, Mexico, Brazil, Germany, Hong Kong, Singapore and China.
Heilind Asia Pacific (www.heilindasia.com) commenced operations in Dec 2012, and now has 19 locations throughout Asia. Its industry leading service offering to customers in Asia Pacific is the result of a commitment to the belief of "Distribution As It Should Be".
Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including data communications, telecommunications, and consumer electronics, industrial, automotive, medical, military, lighting and solar. Established in 1938, the company operates 39 manufacturing locations in 16 countries. The Molex website is http://www.molex.com.
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