Caen, March 18th 2014 â€“ Four years after the launch of its PRIIM project (platform for the realization of shared industrial innovation), IPDiA presents the major technological results achieved during this program.
Online PR News – 26-March-2014 – Caen – In January 2010, IPDiA announced the launch of a major R&D program named PRIIM, in collaboration with industrial partners (Movea, Sorin, Gemalto and Kalray) and technological partners (CEA-Leti, CRISMAT(1), 3D Plus and CNRS LAAS). The aim of this program led by IPDiA and supported by Bpifrance was to define new application requirements for high-growth markets such as implantable medical devices (stimulators, defibrillators, motion detectors), multimedia chips and complex embedded systems.
Within this project, IPDiA and CEA-Leti highlight three technological results related to high performance and size reduction benefits:
â€˘ With 250 nF/mmÂ˛ at the beginning of the project, the capacitance density for 3D silicon capacitors has achieved a new world record with a value increased by a factor of 4.
â€˘ The work conducted on components thickness â€“ originally at 250 Âµm â€“ has been a success and a new range of ultra low profile capacitors with a thickness of 80 Âµm has been introduced.
â€˘ The innovations carried out on TSV (Through Silicon Via or interconnects through the silicon) have led to a significant increase in the electrical performance of micro-modules.
On top of these R&D results, the other main objective of PRIIM was industrialization of these technologies. Thanks to the partnerships set up, several demonstrators have been developed and have reached the qualification stage with IPDiAâ€™s key customers. Many demonstrators refer to medical applications for which IPDiA integrated systems enable savings of up to 90 % of the total size of the product and increased electrical performance.
Finally, PRIIM has confirmed the strong partnership between IPDiA and CEA-Leti and unveiled a new cooperation with CRISMAT. IPDiA has taken advantage of these 4 years R&D to sustain its international leadership as silicon component manufacturer and strengthen its position in the implantable medical devices market.
IPDiA, leader in integration technologies for silicon passive components, proposes a global miniaturization offer with a very high technological and economic performance level. The company focuses on the following main sectors: medical, lighting, communication, defense, aerospace, industrial and automotive. For further information, visit www.ipdia.com
(1)CRISMAT â€“ Laboratoire de Cristallographie et Sciences des MatĂ©riaux - CNRS, ENSICAEN, UniversitĂ© de Caen Basse-Normandie